reichelt elektronik GmbH & Co. KG
Elektronikring 1
26452 Sande Germany

phone: +49 (0)4422 955-333
mail: info@reichelt.de
www.reichelt.de


V ICK BGA23X23 :: Heat sink for BGA, 23 x 23 x 6 mm

Item-No.: V ICK BGA23X23
€0,86
Category of goods: 1

ICK BGA 23 X23

  • Product Description
  • Technical information
  • General
    • Type
    • Heat sink
    • Technology
    • For BGA (ball grid array)
    • Design
    • Square
    • Colour
    • Black
    • Material
    • Aluminium, anodized
  • Implementation
    • Mounting
    • Adhesive thermal conductive foil
  • Measures
    • Length
    • 23 mm
    • Width
    • 23 mm
    • Height
    • 6 mm

Heat sink, ideal for BGA (ball grid arrays)

Square design
Can be stuck directly onto the PGA component with heat-conducting foil
Black anodised surface



Manufacturer : FISCHER ELEKTRONIK
Factory number : 10037026
Package weight : 0.003 kg
RoHS : conform
Technical information
  • General
    • Type
    • Heat sink
    • Technology
    • For BGA (ball grid array)
    • Design
    • Square
    • Colour
    • Black
    • Material
    • Aluminium, anodized
  • Implementation
    • Mounting
    • Adhesive thermal conductive foil
  • Measures
    • Length
    • 23 mm
    • Width
    • 23 mm
    • Height
    • 6 mm
Datasheet/manual